BRM-DK Series

[BRM-A] / Blocky Series Micron Diamond Powder

[BRM-B] Sharpened Series Micron Diamond Powder

[BRM-GC] High Purity Micron Diamond Powder

BRD810- Boron Polycrystalline Diamond

[BRM-GQ] High Strength Micron Diamond Powder

[BRM-WSD] Micron Diamond Powder for Diamond Wire

[BRM-PCD] Micron Diamond Powder for PCD Synthesis

[BRM-Z] Reshaped Mesh Diamond Powder

[BRM-P] Crushed Mesh Diamond Powder

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BRD810 Boron Polycrystalline Diamond - High-Performance Abrasives for Precision Manufacturing | China Suppliers & Factory

Introducing the **BRD810**, a groundbreaking advancement in diamond abrasive technology designed specifically for advanced manufacturing. This exceptional product offers high-performance, durability, and reliability, empowering customers to elevate their precision and efficiency. As a leading choice among **China's suppliers**, the BRD810 is manufactured in our state-of-the-art **factory**, ensuring top-notch quality and innovative solutions tailored to meet your manufacturing needs. Experience the difference that the BRD810 can make in your operations today!

Product Detail

Self-Sharpening Performance

Micro-edges fracture during grinding, continuously exposing new sharp cutting points.
Ensures consistent cutting efficiency and long-term process stability.

Superior Heat & Wear Resistance

Oxidation onset temperature is 150–250°C higher than conventional diamond.
Boron-carbon bonding structure resists oxidation and enhances durability.
Extends tool life under high-load, high-temperature conditions.

Enhanced Bonding Strength

Rougher surface morphology improves mechanical interlocking with bonding agents.
Reduces premature grain shedding.
Ideal for high-end diamond tool manufacturing.

Specifications

Grain Size Range: 50/60 to 325/400

Applications: High-precision grinding, cutting, and polishing across advanced ceramics, semiconductors, and hard metals.

Frequently Asked Questions

How does the self-sharpening mechanism work?

During the grinding process, the micro-edges of the diamond grains fracture in a controlled manner. This continuously exposes new, sharp cutting points, maintaining high cutting efficiency and process stability over time.

What makes this material more heat resistant than conventional diamond?

It features a specialized boron-carbon bonding structure that raises the oxidation onset temperature by 150–250°C compared to conventional diamonds, significantly enhancing durability under high temperatures.

How does enhanced bonding strength prevent grain shedding?

The rougher surface morphology of the grains improves the mechanical interlocking with bonding agents. This strong physical hold prevents premature grain shedding during heavy-duty operations.

What grain sizes are available for this diamond abrasive?

The product is available in a versatile grain size range from 50/60 to 325/400, catering to various stages of grinding and polishing.

What are the primary applications for these specifications?

It is ideal for high-precision grinding, cutting, and polishing applications across advanced ceramics, semiconductor substrates, and hard metals.