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BRD810 Boron Polycrystalline Diamond: High-Performance Abrasives from China Suppliers and Factory
Self-Sharpening Performance
- Micro-edges fracture during grinding, continuously exposing new sharp cutting points
- Ensures consistent cutting efficiency and long-term process stability
Superior Heat & Wear Resistance
- Oxidation onset temperature is 150–250°C higher than conventional diamond
- Boron-carbon bonding structure resists oxidation and enhances durability
- Extends tool life under high-load, high-temperature conditions
Enhanced Bonding Strength
- Rougher surface morphology improves mechanical interlocking with bonding agents
- Reduces premature grain shedding
- Ideal for high-end diamond tool manufacturing
Specifications
- Grain Size Range: 50/60 to 325/400
- Applications: High-precision grinding, cutting, and polishing across advanced ceramics, semiconductors, and hard metals
Frequently Asked Questions
During the grinding process, micro-edges fracture at controlled rates, which continuously exposes new, sharp cutting points. This ensures consistent cutting efficiency and long-term stability.
The oxidation onset temperature is 150–250°C higher than conventional diamond, thanks to its specialized boron-carbon bonding structure that effectively resists oxidation under high thermal loads.
The material features a rougher surface morphology, which significantly improves mechanical interlocking with bonding agents. This prevents premature grain shedding and extends the lifespan of diamond tools.
The grain sizes range from 50/60 to 325/400, catering to various requirements for high-precision manufacturing processes.
They are ideal for high-precision grinding, cutting, and polishing across advanced ceramics, semiconductors, and hard metals where high-load stability is required.