BRM-DK Series

[BRM-A] / Blocky Series Micron Diamond Powder

[BRM-B] Sharpened Series Micron Diamond Powder

[BRM-GC] High Purity Micron Diamond Powder

BRD810- Boron Polycrystalline Diamond

[BRM-GQ] High Strength Micron Diamond Powder

[BRM-WSD] Micron Diamond Powder for Diamond Wire

[BRM-PCD] Micron Diamond Powder for PCD Synthesis

[BRM-Z] Reshaped Mesh Diamond Powder

[BRM-P] Crushed Mesh Diamond Powder

0102030405

BRD810 Boron Polycrystalline Diamond: High-Performance Solutions from China Factory Suppliers

Introducing the **BRD810**, a revolutionary advancement in diamond abrasive technology that sets new standards for high-performance solutions in advanced manufacturing. As a trusted product from leading suppliers in China, the BRD810 offers exceptional durability and reliability, empowering factories to elevate their precision and efficiency. Discover how our innovative technology can transform your manufacturing processes, ensuring you stay ahead in today's competitive market. Choose the BRD810 for your factory's needs and experience superior performance tailored for the demands of modern production

Product Detail

Self-Sharpening Performance

Micro-edges fracture during grinding, continuously exposing new sharp cutting points
Ensures consistent cutting efficiency and long-term process stability

Superior Heat & Wear Resistance

Oxidation onset temperature is 150–250°C higher than conventional diamond
Boron-carbon bonding structure resists oxidation and enhances durability
Extends tool life under high-load, high-temperature conditions

Enhanced Bonding Strength

Rougher surface morphology improves mechanical interlocking with bonding agents
Reduces premature grain shedding
Ideal for high-end diamond tool manufacturing

Specifications

Grain Size Range: 50/60 to 325/400
Applications: High-precision grinding, cutting, and polishing across advanced ceramics, semiconductors, and hard metals

Frequently Asked Questions

How does the self-sharpening mechanism work?

During high-load grinding processes, the micro-edges of the diamond grains undergo controlled micro-fracturing. This continuously exposes brand-new, sharp cutting edges instead of allowing the grain to dull, maintaining highly efficient cutting performance.

What makes these diamond grains highly heat resistant?

Due to the integrated boron-carbon bonding structure, these diamonds possess an oxidation onset temperature that is 150–250°C higher than standard synthetic diamonds, offering exceptional stability under thermal load.

Why is enhanced bonding strength important for tooling?

The rougher surface morphology of these grains improves the mechanical interlocking with bonding agents (like metal or resin matrices). This minimizes premature grain shedding, ensuring a much longer tool life.

What industries benefit most from these specifications?

Industries involved in semiconductor processing, advanced ceramics machining, and hard metal fabrication benefit significantly from the precision and durability of these abrasives.

Which grain size is recommended for high-precision polishing?

For finer finishing and high-precision polishing, grain sizes towards the 325/400 range are recommended, whereas coarser sizes like 50/60 are ideal for heavy-duty grinding.