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BRM-DK Series

BRM-DK Series
[BRM-A] / Blocky Series Micron Diamond Powder

[BRM-A] / Blocky Series Micron Diamond Powder
[BRM-B] Sharpened Series Micron Diamond Powder

[BRM-B] Sharpened Series Micron Diamond Powder
[BRM-GC] High Purity Micron Diamond Powder

[BRM-GC] High Purity Micron Diamond Powder
BRD810- Boron Polycrystalline Diamond

BRD810- Boron Polycrystalline Diamond
[BRM-GQ] High Strength Micron Diamond Powder

[BRM-GQ] High Strength Micron Diamond Powder
[BRM-WSD] Micron Diamond Powder for Diamond Wire

[BRM-WSD] Micron Diamond Powder for Diamond Wire
[BRM-PCD] Micron Diamond Powder for PCD Synthesis

[BRM-PCD] Micron Diamond Powder for PCD Synthesis
[BRM-Z] Reshaped Mesh Diamond Powder

[BRM-Z] Reshaped Mesh Diamond Powder
[BRM-P] Crushed Mesh Diamond Powder

[BRM-P] Crushed Mesh Diamond Powder
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High-Performance BRD810 Boron Polycrystalline Diamond from Leading China Suppliers and Factory

Introducing the BRD810 – a groundbreaking innovation in diamond abrasive technology, designed for advanced manufacturing. As a leading choice among China suppliers and factories, the BRD810 offers high-performance, durable, and reliable solutions. This product empowers businesses to elevate their precision and efficiency, setting new industry standards. Embrace the future of manufacturing with the BRD810 and experience unmatched quality and performance
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    Product Detail

    Self-Sharpening Performance

    • Micro-edges fracture during grinding, continuously exposing new sharp cutting points
    • Ensures consistent cutting efficiency and long-term process stability

    Superior Heat & Wear Resistance

    • Oxidation onset temperature is 150–250°C higher than conventional diamond
    • Boron-carbon bonding structure resists oxidation and enhances durability
    • Extends tool life under high-load, high-temperature conditions

    Enhanced Bonding Strength

    • Rougher surface morphology improves mechanical interlocking with bonding agents
    • Reduces premature grain shedding
    • Ideal for high-end diamond tool manufacturing

    Specifications

    • Grain Size Range: 50/60 to 325/400
    • Applications: High-precision grinding, cutting, and polishing across advanced ceramics, semiconductors, and hard metals

    Frequently Asked Questions

    Q1: How does the self-sharpening mechanism work?
    A: During the grinding process, the micro-edges of the diamond grains fracture in a controlled manner. This continuously exposes new, sharp cutting points, maintaining high cutting efficiency and process stability.
    Q2: Why does this material offer superior heat resistance?
    A: It features a specialized boron-carbon bonding structure that raises the oxidation onset temperature by 150–250°C compared to conventional diamonds, protecting the tool from premature thermal degradation.
    Q3: What causes the enhanced bonding strength of these grains?
    A: The grains are engineered with a rougher surface morphology, which significantly improves mechanical interlocking with bonding agents and prevents premature shedding during high-load operations.
    Q4: What are the primary applications for these specifications?
    A: They are widely used for high-precision grinding, cutting, and polishing of advanced ceramics, semiconductors, and hard metals.
    Q5: What grain sizes are available for this product?
    A: The standard grain size range spans from 50/60 to 325/400, catering to various stages of grinding and polishing.

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