Titanium Coating for Diamonds: Enhancing Heat Dissipation from China Suppliers and Factory
Descriptions
Coated metal can improve heat dissipation and reduce heat damage thus protect the diamond (decrease diamond carbonization when sintering at ultrahigh temperature). Roughen the diamond particle surface to enhance the mechanical retention between diamond and bonds.
Chemical Nickel Coating
Mainly for resin bond products.
Electroplated Nickel Coating
Mainly for resin bond products.
Copper Coating
Mainly for metal bond products.
Ti Coating
Mainly for metal and ceramic bond products.
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Increase the strength of diamond and provide longer tool life.
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Improves the retention force between diamond and bond.
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Prevents diamond surfaces from chemical etching and oxidation.
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Helps in heat dissipation, withstand the highest grinding force and temperature.
Frequently Asked Questions
Q1: How does metal coating protect the diamond during sintering?
Coated metal improves heat dissipation and reduces heat damage. This effectively protects the diamond by decreasing diamond carbonization when sintering at ultrahigh temperatures.
Q2: Why is the surface of the diamond particle roughened?
Roughening the diamond particle surface enhances the mechanical retention between the diamond and the bonds, ensuring a stronger hold and better performance.
Q3: Which coatings are suitable for resin bond products?
Chemical nickel coating and Electroplated nickel coating are mainly designed and recommended for resin bond products.
Q4: What are the applications for Copper and Ti (Titanium) coatings?
Copper coating is mainly used for metal bond products, while Ti coating is primarily suitable for metal and ceramic bond products.
Q5: What coating sizes are currently available?
Currently, we offer a standard specification of 2% coated (by weight) diamond particles.
Q6: How does the coating prevent chemical etching?
The metal coating acts as a protective barrier on the diamond surface, which prevents chemical etching and oxidation, thereby extending the tool life.
