Ukuphathwa Kokushisa Kwedayimane: Isihluthulelo Sokuxazulula Izinselele Zokushisa Kwe-AI Chip

Inkinga Efihliwe Kwikhompyutha Ye-AI

Ngo-2026, ukubalwa kwe-AI akusanqunyelwe amandla okucubungula kuphela. Inkinga yangempela iwukuthi ukushabalalisa ukushisa.

Ama-GPU anamuhla asebenza kahle kakhulu angadlula 2000W nge-chip ngayinye, kuyilapho ubuningi bokushisa bufinyelela ngaphezulu 1000 W/cm²Kuleli zinga, izixazululo zokupholisa zendabuko njengezinki zokushisa zethusi, izakhiwo ze-aluminium, kanye nokupholisa uketshezi zisondela emikhawulweni yazo ebonakalayo.

Ngenxa yalokho, ukuphathwa kokushisa kube ngenye yezinselele ezibaluleke kakhulu kwihadiwe ye-AI yesizukulwane esilandelayo.

Lokhu kushukumisa intshisekelo enkulu embonini ezintweni ezithuthukisiwe: idayimane.

Kungani iDayimane?

Idayimane akuyona nje into eyaziwayo kakhulu, kodwa futhi ingenye yezinjini zokushisa ezinhle kakhulu zemvelo.

Ukushisa kwayo kufinyelela 2000–2600 W/(m·K):

• ~5× ephakeme kunethusi
• ~10× ephakeme kune-aluminium
• ~13× ephakeme kune-silicon

Ukushisa okusedayimaneni kudluliselwa kakhulu ngokusebenzisa ama-phononi (ukudlidliza kwe-lattice), inikwe amandla yisakhiwo sayo esiqinile se-sp³ covalent.

Ngaphezu kokushisa okuphezulu, idayimane inikeza nezinzuzo ezintathu ezibalulekile:

• Ukwanda okuphansi kokushisa→ iyahambisana ne-Si, i-SiC, ne-GaN
• Ukushisa ngogesi→ igwema ukuphazamiseka kwesignali
• Ukuqina okuphezulu→ uthembekile ngaphansi kwezimo ezimbi kakhulu

Le nhlanganisela yenza idayimane ifaneleke kakhulu ekuphathweni kokushisa kwe-semiconductor okuthuthukisiwe.

Kungani Ukuphathwa Kokushisa Kubalulekile

Ukusebenza kokushisa kuthinta ngqo ukuthembeka kwama-chip.

Idatha yemboni ikhombisa:

• Njalo Ukwenyuka kwe-1°Ckunganciphisa ukuthembeka cishe 5% 
• Ingozi enkulu yokwehluleka yenzeka ngenhla 70–80°C
• Kuphelile Ukwehluleka kwe-elekthronikhi okungu-50%zihlobene nokushisa ngokweqile

Ezimweni eziningi, ukuthuthukisa ukusebenza kahle kokupholisa kubaluleke kakhulu kunokwandisa amandla okusebenzisa ikhompyutha uqobo.

Yingakho izixazululo zedayimane ezishisayo sezivele zisetshenziswa ku izinhlelo zezindiza, ezokuvikela, nezesathelayithi, lapho ukwethembeka kubaluleke kakhulu.

Ubuchwepheshe Obuthathu Obuyinhloko Bedayimane Obushisayo

1. Izinhlanganisela zeDayimane/zethusi (Isigaba Sokukhiqiza Okukhulu)

Lesi yisisombululo esithengiswa kakhulu njengamanje.

Izinhlayiya zedayimane zifakwa ethusi noma e-aluminium ukuze zakhe izinhlanganisela ezisebenza kahle kakhulu.

Ukusebenza:

• Ukuqhuba kwe-thermal: 500–1000 W/(m·K)

Izicelo:

• Amamojula kagesi e-EV
• Izinhlelo zamandla eseva
• Ama-LED anamandla aphezulu

Le ndlela ihola ukwamukelwa kwezimboni ezinkulu ekuqaleni ngenxa yokulinganisela kwayo izindleko kanye nokusebenza.

2. Izisabalalisi Zokushisa Zedayimane Ze-CVD (Isixazululo se-AI Esiphezulu)

Idayimane ye-CVD (Chemical Vapor Deposition) inikeza ukusebenza okuphezulu kakhulu kokushisa.

Ukusebenza:

• Kuya ku 2200 W/(m·K)(idayimane elicwebezelayo elilodwa)

Izici ezibalulekile:

• Ubumsulwa obuphezulu kakhulu
• Ikhono elihle kakhulu lokusabalalisa ukushisa
• Iyahambisana nokupakishwa kwe-semiconductor okuthuthukisiwe

Izicelo:

• Ama-AI GPU nama-chip e-HPC
• Amadivayisi e-RF ne-GaN
• Ukupakisha kwe-semiconductor okuthuthukisiwe

Ngo-2026, Imigqa yokukhiqiza i-CVD diamond heat spreader engu-8-intshibangene ekukhiqizweni kwezinga lezimboni, okuphawula ingqophamlando ebalulekile yokuhweba.

3. Ukuhlanganiswa Kwedayimane Elisezingeni Le-Chip (Isiqondiso Sesikhathi Esizayo)

Umgomo wesikhathi eside ukuhlanganisa idayimane ngqo kuma-chips ngokusebenzisa amasu okukhulisa noma okubopha.

Lokhu kuzoqeda ukumelana kwesikhombikubona sokushisa futhi kuvumele ukukhishwa kokushisa okuqondile kusuka ku-chip core.

Noma kunjalo, izinselele zisekhona:

• Ukungafani kwezinto ezibonakalayo ne-silicon ne-GaN
• Izinqubo zokukhiqiza eziyinkimbinkimbi
• Izindleko zokukhiqiza eziphakeme

Naphezu kwalokhu, ucwaningo lwasekuqaleni seluvele lukhombisile ukwehla kwezinga lokushisa okungaphezu kwama-20°C, okufakazela amandla amakhulu.

Ukwandisa Izinhlelo Zokusebenza

Izikhungo ze-AI kanye nedatha

Ama-chip e-AI akhiqiza imithwalo yokushisa eyingozi kakhulu. Izinto zokushisa zedayimane zinganciphisa kakhulu amazinga okushisa okusebenza futhi zithuthukise ukuzinza kwesistimu.

Izimoto Zikagesi

Amamojula kagesi (i-SiC ne-IGBT) kuma-EV adinga ukusatshalaliswa kokushisa okusebenzayo. Ama-diamond composites aya ngokuya ehlolwa ezinhlelweni ze-inverter.

Amadivayisi e-5G kanye ne-RF

Izingxenye ze-GaN ezinamandla aphezulu eziteshini eziyisisekelo ziyazuza kuma-substrate edayimane ukuze kuthuthukiswe ukulawula ukushisa.

Izindiza kanye namaSathelayithi

Idayimane selisetshenziswa kakade ezinhlelweni zasemkhathini ngenxa yokwethembeka kwalo okungenakuqhathaniswa ngaphansi kwezimo ezimbi kakhulu.

Izinselele kanye Nezithiyo Zezindleko

Naphezu kwezinzuzo ezinhle zokusebenza, ubuchwepheshe bokushisa kwedayimane busabhekene nezinselele:

• Izindleko eziphezulu(okwamanje izixazululo zethusi ezingu-10–20×)
• Ukucubungula okuyinkimbinkimbi(kudingeka ukusika nge-laser kanye ne-micromachining)
• Ubunzima bokukalaukukhiqizwa okufanayo endaweni enkulu

Kodwa-ke, izindleko ziyancipha ngenxa yalokhu:

• Indawo yemishini ye-CVD
• Ukusebenza kahle kokubeka okuthuthukisiwe
• Ukwandisa izinga lokukhiqiza
• Ukulawulwa kwenqubo okwenziwe ngcono yi-AI