Ulawulo lweDiamond Thermal: Isitshixo sokusombulula imingeni yobushushu be-AI Chip

Ingxaki Efihlakeleyo Kwikhompyutha Ye-AI

Ngowama-2026, i-AI computing ayisathintelwa ngamandla okucubungula kuphela. Eyona ngxaki yokwenyani yile ukusasazwa kobushushu.

IiGPU zanamhlanje ezisebenza kakuhle zinokudlula 2000W ngetshiphu nganye, ngelixa ubuninzi bobushushu bufikelela ngaphezulu 1000 W/cm²Kule nqanaba, izisombululo zokupholisa zemveli ezifana nezitya zokupholisa ubushushu zekopolo, izakhiwo ze-aluminiyam, kunye nokupholisa ulwelo zisondela kwimida yazo ebonakalayo.

Ngenxa yoko, ulawulo lobushushu lube ngomnye wemingeni ebalulekileyo kwizixhobo ze-AI zesizukulwana esilandelayo.

Oku kukhuthaza umdla omkhulu kushishino kwizinto ezintsha: idayimani.

Kutheni iDayimane?

Idayimani ayisiyonto inzima kakhulu eyaziwayo kuphela, kodwa ikwayenye yezona ziqhubi zobushushu zibalaseleyo kwindalo.

Ukuqhuba kwayo ubushushu kufikelela 2000–2600 W/(m·K):

• ~5× iphezulu kunethusi
• ~10× iphezulu kune-aluminium
• ~13× iphezulu kunesilicon

Ubushushu obukwidayimani budluliselwa ikakhulu nge iifonini (ukungcangcazela kwelattice), inikwe amandla yisakhiwo sayo esomeleleyo se-sp³ covalent.

Ukongeza kwi-thermal conductivity ephezulu, idayimani ikwabonelela ngeenzuzo ezintathu eziphambili:

• Ukwanda okuphantsi kobushushu→ iyahambelana neSi, iSiC, kunye neGaN
• Ubushushu bombane→ ithintela ukuphazamiseka kwesignali
• Uzinzo oluphezulu→ ukuthembeka phantsi kweemeko ezinzima

Olu didi lwenza idayimani ilungele ulawulo oluphezulu lobushushu be-semiconductor.

Kutheni Ulawulo Lobushushu Lubalulekile

Ukusebenza kobushushu kuchaphazela ngokuthe ngqo ukuthembeka kweetship.

Idatha yoshishino ibonisa:

• Yonke Ukunyuka kwe-1°Cinokunciphisa ukuthembeka malunga 5% 
• Umngcipheko ophezulu wokungaphumeleli uyenzeka ngasentla 70–80°C
• Phezu I-50% yokusilela kwe-elektronikizinxulumene nokushisa kakhulu

Kwiimeko ezininzi, ukuphucula ukusebenza kakuhle kokupholisa kubaluleke ngakumbi kunokwandisa amandla ekhompyutha ngokwawo.

Yingakho izisombululo zedayimani ezishushu sele zisetyenziswa iinkqubo zeenqwelo-moya, ezokhuselo, nezesathelayithi, apho ukuthembeka kubaluleke kakhulu.

Iiteknoloji ezintathu eziphambili zeDayimani ezishushu

1. IiDiamond/Copper Composites (Inqanaba leMveliso yoBuninzi)

Esi sesona sisombululo sithengiswa kakhulu okwangoku.

Amasuntswana edayimani afakwa kwi-copper okanye kwi-aluminium ukuze enze izinto ezidityanisiweyo ezisebenza kakuhle.

Ukusebenza:

• Ukuqhuba kobushushu: 500–1000 W/(m·K)

Izicelo:

• Iimodyuli zamandla ze-EV
• Iinkqubo zamandla eseva
• Ii-LED ezinamandla aphezulu

Le ndlela ikhokela ukwamkelwa kwemizi-mveliso emikhulu kwangethuba ngenxa yokulinganisela kwayo iindleko kunye nokusebenza.

2.Ii-CVD Diamond Heat Spreaders (Isisombululo se-AI esiPhezulu)

Idayimani yeCVD (Chemical Vapor Deposition) inika ukusebenza okuphezulu kobushushu.

Ukusebenza:

• Ixhomekeke ku 2200 W/(m·K)(idayimani enemibala eqaqambileyo)

Ezona mpawu:

• Ubumsulwa obuphezulu kakhulu
• Ubuchule obuhle bokusasaza ubushushu
• Iyahambelana nokupakisha kwe-semiconductor ephucukileyo

Izicelo:

• Ii-AI GPU kunye neetships ze-HPC
• Izixhobo zeRF kunye neGaN
• Ukupakisha kwe-semiconductor okuphucukileyo

Ngowama-2026, Imigca yemveliso yokusasaza ubushushu bedayimani ye-CVD ye-intshi ezi-8bangene kwimveliso ekumgangatho wemizi-mveliso, nto leyo ephawula inqanaba elibalulekileyo lorhwebo.

3. Ukuhlanganiswa kweDayimani yeNqanaba leChip (Ulwalathiso lwexesha elizayo)

Injongo yexesha elide kukudibanisa idayimani ngqo kwiitships ngokusebenzisa iindlela zokukhulisa okanye zokubopha.

Oku kuya kuphelisa ukumelana nobushushu kwaye kuvumele ukukhutshwa kobushushu ngqo kwi-chip core.

Nangona kunjalo, imingeni isekho:

• Ukungafani kwezinto ezibonakalayo ne-silicon kunye ne-GaN
• Iinkqubo zokwenziwa ezintsonkothileyo
• Ixabiso eliphezulu lemveliso

Nangona kunjalo, uphando lwangaphambili sele lubonisile ukwehla kwamaqondo obushushu angaphezu kwama-20°C, ebonisa amandla aqinileyo.

Ukwandisa Izicelo

Amaziko e-AI kunye neDatha

Iitships ze-AI zivelisa ubushushu obukhulu. Izinto ezisebenzisa ubushushu bedayimani zinokunciphisa kakhulu ubushushu bokusebenza kwaye ziphucule uzinzo lwenkqubo.

Izithuthi zombane

Iimodyuli zamandla (i-SiC kunye ne-IGBT) kwii-EV zifuna ukusasazwa kobushushu okusebenzayo. Ii-diamond composites ziyavavanywa ngakumbi kwiinkqubo ze-inverter.

Izixhobo ze-5G kunye ne-RF

Izixhobo zeGaN ezinamandla aphezulu kwizikhululo zesiseko ziyazuza kwi-substrates zedayimani ukuze kuphuculwe ulawulo lobushushu.

I-Aerospace kunye neeSatellite

Idayimani sele isetyenziswa kwiinkqubo zasemajukujukwini ngenxa yokuthembeka kwayo okungenakuthelekiswa nanto phantsi kweemeko ezinzima.

Imingeni kunye nemiqobo yeendleko

Nangona kukho iingenelo ezinamandla zokusebenza, iteknoloji yobushushu bedayimani isajongene nemingeni:

• Ixabiso eliphezulu(okwangoku izisombululo zobhedu eziyi-10–20×)
• Ukucubungula okunzima(kufuneka ukusika nge-laser kunye nomatshini wokusika nge-micromachine)
• Ubunzima bokukalayemveliso efanayo kwindawo enkulu

Nangona kunjalo, iindleko ziyehla ngenxa yezi zinto zilandelayo:

• Indawo yezixhobo zeCVD
• Ukuphucula ukusebenza kakuhle kokubeka
• Ukwandisa ubungakanani bemveliso
• Ulawulo lwenkqubo olulungiselelwe i-AI