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BRM-DK Series

BRM-DK Series
[BRM-A] / Blocky Series Micron Diamond Powder

[BRM-A] / Blocky Series Micron Diamond Powder
[BRM-B] Sharpened Series Micron Diamond Powder

[BRM-B] Sharpened Series Micron Diamond Powder
[BRM-GC] High Purity Micron Diamond Powder

[BRM-GC] High Purity Micron Diamond Powder
BRD810- Boron Polycrystalline Diamond

BRD810- Boron Polycrystalline Diamond
[BRM-GQ] High Strength Micron Diamond Powder

[BRM-GQ] High Strength Micron Diamond Powder
[BRM-WSD] Micron Diamond Powder for Diamond Wire

[BRM-WSD] Micron Diamond Powder for Diamond Wire
[BRM-PCD] Micron Diamond Powder for PCD Synthesis

[BRM-PCD] Micron Diamond Powder for PCD Synthesis
[BRM-Z] Reshaped Mesh Diamond Powder

[BRM-Z] Reshaped Mesh Diamond Powder
[BRM-P] Crushed Mesh Diamond Powder

[BRM-P] Crushed Mesh Diamond Powder
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BRD810- Boron Polycrystalline Diamond

BRD810 not only pioneers a new path in diamond abrasive technology, but also delivers high-performance, durable, and reliable solutions tailored for advanced manufacturing. It empowers customers to achieve the next level of precision and efficiency.

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    Key Features
    Self-Sharpening Mechanism Explained
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    BRD810 is synthesized directly using a cubic press (six-sided high-pressure apparatus), forming boron-doped polycrystalline diamond in a single step. Similar to the structure of single-crystal diamond, boron atoms substitute for carbon atoms within the lattice during synthesis. This atomic substitution significantly alters the material’s properties—enhancing oxidation resistance, electrical conductivity, chemical stability, and mechanical performance.

    Recommended for fine ceramics, glass, sapphire, aerospace materials, 3C products, geological drilling, other industries with special processing requirements. diamond powder has excellent light transmission and corrosion resistance, and is widely used in the electronics industry.

    Self-Sharpening Performance

    • · Micro-edges fracture during grinding, continuously exposing new sharp cutting points
    • · Ensures consistent cutting efficiency and long-term process stability

    Superior Heat & Wear Resistance

    • · Oxidation onset temperature is 150–250°C higher than conventional diamond

      · Boron-carbon bonding structure resists oxidation and enhances durability

      · Extends tool life under high-load, high-temperature conditions

    Enhanced Bonding Strength

    • · Rougher surface morphology improves mechanical interlocking with bonding agents

      · Reduces premature grain shedding

      · Ideal for high-end diamond tool manufacturing

    Specifications

    • · Grain Size Range: 50/60 to 325/400

      · Applications: High-precision grinding, cutting, and polishing across advanced ceramics, semiconductors, and hard metals

    Unlike conventional abrasives that dull over time, polycrystalline diamond consists of numerous microcrystalline “sub-grains.” As these sub-grains wear during grinding, they detach and reveal fresh, sharp cutting edges. This unique property allows BRD810 to maintain sharpness, boosting grinding efficiency and consistency.

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