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0102030405
BRM-DK Series
★ Strong Retention Force
The particle surface is rough with a large specific surface area, ensuring a firm bond with the binder. This significantly enhances the abrasive retention within the tool, thereby extending product service life.
★ High Material Removal Rate
The particles feature numerous sharp cutting edges on their surfaces, effectively increasing the cutting efficiency of the tool.
★ High Surface Accuracy of the Workpiece
Compared to conventional diamond micron powders, which have large and hard cutting edges that tend to cause deep scratches, this product features smaller and less hard cutting edges. As a result, surface scratches on the workpiece are noticeably reduced, leading to improved surface accuracy.
Semiconductor Industry:
Lapping and polishing of SiC wafers, sapphire wafers, and other semiconductor materials.
Intelligent Wearable Devices:
Processing of sapphire windows, ceramic backplates, stainless steel, and other metal components for mobile phones and smartwatches.
Optical Industry:
Lapping and polishing of optical lenses.
Other Industries:
Other Industries:
Metallographic polishing, and lapping and polishing of titanium alloys, aluminum alloys, and other metal materials.
Superhard Material Products Manufacturing:
Superhard Material Products Manufacturing:
Production of precision grinding wheels, soft grinding discs, diamond polishing pads, and related products.
Available specifications for similar polycrystalline diamond
| Specifications | D50(μm) | Available sizes |
| M1/2 | 1.50±0.22 | √ |
| M2/4 | 3.0±0.3 | √ |
| M3/6 | 4.5±0.45 | √ |
| M4/8 | 6.0±0.6 | √ |
| M5/10 | 7.5±0.75 | √ |
| M6/12 | 9.0±0.9 | √ |
| M8/16 | 12.0±1.2 | √ |
| M10/20 | 15.0±1.5 | √ |
| M15/25 | 20.0±2.0 | √ |
| M20/30 | 25.0±2.5 | √ |
| M25/35 | 30.0±3.0 | √ |
| M30/40 | 35.0±3.5 | √ |
| M35/55 | 45.0±4.5 | √ |
| M40/60 | 50.0±5.0 | √ |
| 270/325 | 49~57 | √ |
| 230/270 | 57~65 | √ |
Remarks: Other specifications can be customized according to customer's requirements.