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0102030405
Seri BRM-DK
★ Kekuatan Retensi sing Kuat
Permukaan partikel kasar kanthi area permukaan spesifik sing amba, njamin ikatan sing kuwat karo pengikat. Iki nambah retensi abrasif ing njero alat kanthi signifikan, saengga bisa ngluwihi umur layanan produk.
★ Tingkat Pembuangan Materi sing Dhuwur
Partikel-partikel kasebut nduweni akeh pinggiran sing landhep ing permukaane, sing kanthi efektif nambah efisiensi pemotongan alat kasebut.
★ Akurasi Permukaan Benda Kerja sing Dhuwur
Dibandhingake karo bubuk mikron berlian konvensional, sing nduweni pinggiran potong gedhe lan atos sing cenderung nyebabake goresan sing jero, produk iki nduweni pinggiran potong sing luwih cilik lan kurang atos. Akibate, goresan permukaan ing benda kerja saya suda, sing nyebabake akurasi permukaan sing luwih apik.
Industri Semikonduktor:
Nyetel lan poles wafer SiC, wafer safir, lan bahan semikonduktor liyane.
Piranti sing Bisa Dianggo kanthi Cerdas:
Pangolahan jendela safir, pelat mburi keramik, baja tahan karat, lan komponen logam liyane kanggo ponsel lan jam tangan pinter.
Industri Optik:
Nglereni lan nggosok lensa optik.
Industri Liyane:
Industri Liyane:
Polesan metalografi, lan lapping lan polesan paduan titanium, paduan aluminium, lan bahan logam liyane.
Manufaktur Produk Bahan Superhard:
Manufaktur Produk Bahan Superhard:
Produksi roda gerinda presisi, cakram gerinda lunak, bantalan poles berlian, lan produk sing gegandhengan.
Spesifikasi sing kasedhiya kanggo berlian polikristalin sing padha
| Spesifikasi | D50(μm) | Ukuran sing kasedhiya |
| M1/2 | 1.50±0.22 | √ |
| M2/4 | 3.0±0.3 | √ |
| M3/6 | 4.5±0.45 | √ |
| M4/8 | 6.0±0.6 | √ |
| M5/10 | 7.5±0.75 | √ |
| M6/12 | 9.0±0.9 | √ |
| M8/16 | 12.0±1.2 | √ |
| M10/20 | 15.0±1.5 | √ |
| M15/25 | 20.0±2.0 | √ |
| M20/30 | 25.0±2.5 | √ |
| M25/35 | 30.0±3.0 | √ |
| M30/40 | 35.0±3.5 | √ |
| M35/55 | 45.0±4.5 | √ |
| M40/60 | 50.0±5.0 | √ |
| 270/325 | 49~57 | √ |
| 230/270 | 57~65 | √ |
Cathetan: Spesifikasi liyane bisa disesuaikan miturut kabutuhan pelanggan.