I-diamond micro-powder electroless nickel plating yiteknoloji yokuqala esebenzayo, ebizwa ngokuba yi-diamond metallization plating, i-diamond micro-powder electroless nickel plating ilingana ne-diamond micro-powder enxibe ijazi elimnyama (i-diamond black powder coat), xa i-diamond plating isetyenziselwa kakhulu izixhobo zedayimani, i-diamond grinding wheel composite plating, ukuze kuphuculwe amandla okubamba edayimani kunye nesixhobo, i-abrasive substrate (siyibiza ngokuba yi-bonding force). Inkqubo yangoku ngokusisiseko ilandela inkqubo yendabuko (ukususwa kweoyile - ukurhabaxa - ukuziva - ukusebenza kwe-palladium - i-electrolysis nickel plating).
Ukususela ngo-2015, ngeshishini le-photovoltaic, inani elikhulu lokukhuthaza kunye nokusetyenziswa kwesarha yedayimani yocingo endaweni yodaka lwendabuko + izinto ze-silicon zokusika i-silicon, isarha yedayimani yocingo njengemveliso ekude kakhulu, ngequbuliso ishushu, ishishini elinxulumene neshishini le-photovoltaic libonisa ukuba ixabiso lemveliso yemarike yesarha yedayimani yangoku limalunga namashumi eebhiliyoni ze-RMB ngonyaka, nto leyo ezisa uphuhliso lweshishini lwesarha yedayimani yocingo oluqhubekayo, njengoko izinto eziphambili zesarha yedayimani yocingo - i-Synthetic Diamond Powder, i-diamond powder electroless nickel plating nayo ihamba nale tuyere, kwiminyaka yakutshanje ibe luphuhliso olukhawulezayo lobuchwepheshe.
Umgubo weDayimani kunye neDayimani: Idayimani ekhankanyiweyo apha yikristale yedayimani yokwenziwa, eveliswa ngokwenziwa yigraphite kunye ne-catalyst kwi-mold ye-hexahedral top press kubushushu obuphezulu kunye noxinzelelo oluphezulu. Uxinano yi-3.5 g / cm3, kwaye ineempawu zomzimba nezekhemikhali zedayimani yendalo. Yinto enobunzima obuphezulu okwangoku, kwaye idla ngokusetyenziselwa ukuvelisa izixhobo zobunzima obuphezulu kunye ne-abrasives. Emva kokutyumza, ukuhluza ubungakanani besuntswana kunye nokwahlulahlula iimilo, ikristale yedayimani yokwenziwa isetyenziswa njengenkcazo emiselweyo yomgubo wedayimani kwisarha yentambo yedayimani. Okwangoku, ubungakanani besuntswana obuqhelekileyo buqala kwi-5 microns ukuya kwi-50 microns, kwaye inqanaba lokwahlula limalunga ne-5 - 10, 8 - 12, 10 - 20, 20 - 30, 30 - 40, 40 - 50 ... (iyunithi yi-micron). Emva kwendlela yokusebenzisa idayimani enkulu kumgca orhabaxa kunye nedayimani encinci yobukhulu besuntswana kumgca ocolekileyo, ngo-2015, ubukhulu obuncinci bemveliso enkulu yebhasi yesarha yedayimani ifikelele kwi-50 microns (iintambo ezi-5), esetyenziselwa ukusika izinto ze-silicon. Ububanzi obuncinci bebhasi yesarha yedayimani yokusika imagnethi engapheliyo yomhlaba yi-120 microns (iintambo ezili-12).
Iimpawu ze-electroless nickel plating kwi-diamond powder: I-coating metal inokuphucula ukusasazwa kobushushu kwaye inciphise umonakalo wobushushu ukuze ikhusele idayimani (ukunciphisa i-carbonization yedayimani ngexesha lokusila kubushushu obuphezulu kakhulu) ukuze umphezulu wee-diamond particles ube rhabaxa kwaye ukugcinwa koomatshini phakathi kwee-diamond particles kuphuculwe;
