Kev Nthuav Qhia Txog Kev Siv Tshuab Sib Tsoo Xyoo 2025 Nyiv Pooj
Kev Siv Tshuab Sib Tsoo Nyiv Pooj 2025
Henan Boreas Tshiab Khoom Co., Ltd.
LubKev Siv Tshuab Sib Tsoo Nyiv Pooj (GTJ) 2025, tuav los ntawmLub Peb Hlis 5–7, 2025, ntawm lubMakuhari Messe International Convention Complexhauv Chiba Prefecture, tau ua kom nws lub koob npe nrov ua qhov kev tshwm sim tseem ceeb hauv Asia rau kev sib tsoo thiab polishing thev naus laus zis siab heev. Tsom mus rau kev siv tshuab ua haujlwm siab, kev siv tshuab, thiab kev tsim kho tshiab, qhov kev nthuav qhia tau nyiam ntau dua300 tus neeg nthuav qhiathiabMuaj 15,000 tus neeg tuaj xyuas kev tshaj lijlos ntawm kev lag luam semiconductor, automotive, thiab cov khoom siv siab heev
Qhov kev tshwm sim tau hais txog kev nce qib tseem ceeb hauvSiC (silicon carbide)thiabGaN (gallium nitride)kev ua cov wafer, ua raws li Nyiv Pooj txoj kev coj noj coj ua hauv kev tsim khoom semiconductor. Cov khoom tseem ceeb suav nrog cov tshuab sib tsoo, cov khoom siv abrasives, cov cuab yeej pob zeb diamond, cov kua txhuam, thiab cov txheej txheem ntsuas qhov tseeb, nrog rau kev tsom mus rau cov kev daws teeb meem rau qhov tiav ntawm qhov chaw du thiab ua haujlwm tau zoo.
Kev Koom Tes ntawm Boreas: Rooj Muag Khoom G108
Boreas, ib lub tuam txhab tsim kho tshiab thoob ntiaj teb hauv kev daws teeb meem abrasive siab heev, tau nthuav tawm nws cov khoom lag luam tseem ceeb—cov hmoov pob zeb diamond me methiabcov pob zeb diamond slurries ua haujlwm zoo—ntawmRooj Muag Khoom G108Cov kev daws teeb meem no tau tsim los daws cov kev xav tau ntawm SiC thiab GaN substrate processing, muab kev meej thiab kev sib xws rau cov ntawv thov tseem ceeb hauv cov khoom siv hluav taws xob thiab optoelectron.
Cov Khoom Tseem Ceeb thiab Kev Cuam Tshuam Hauv Kev Lag Luam
- Cov hmoov pob zeb diamond:
Boreas cov hmoov pob zeb diamond ultra-uniform yog tsim rauCMP (kev sib xyaw ua ke ntawm tshuaj lom neeg thiab tshuab)thiabkev sib tsoo ultra-precisionntawm SiC wafers. Lawv cov khoom faib submicron ua kom muaj qhov tsis zoo ntawm qhov chaw tsawg kawg nkaus thiab cov nqi ntau dua, qhov zoo dua rau cov tuam txhab tsim khoom uas tsom mus rau lub tsheb fais fab tiam tom ntej (EV) thiab 5G semiconductor kev lag luam.- Cov Pob Zeb Diamond Tshwj Xeeb:
Cov kua dej uas zoo rau ib puag ncig thiab muaj roj nplua nyeem ntawm lub tuam txhab tau ua pov thawj tias nws ua tau zoo heev hauv kev tshem tawm cua sov thiab ua kom cov cuab yeej siv tau ntev thaum lub sijhawm ua haujlwm txhuam hniav GaN. Qhov kev tsim kho tshiab no sib haum nrog cov qauv kev lag luam rau cov kab ntau lawm uas ruaj khov thiab muaj txiaj ntsig zoo.Saib Tom Ntej
Boreas txoj kev vam meej ntawm GTJ 2025 qhia txog nws txoj kev cog lus los txhawb cov thev naus laus zis tsim khoom semiconductor. Thaum kev lag luam hloov mus rau kev siv SiC thiab GaN dav dua, lub tuam txhab npaj yuav nthuav nws cov peev txheej R & D thiab koom tes nrog cov thawj coj thoob ntiaj teb los txhim kho cov kev daws teeb meem sib tsoo tom ntej.Koom nrog Kev Hloov Pauv Precision
Yog xav paub ntxiv txog Boreas cov hmoov pob zeb diamond thiab cov hmoov pob zeb diamond slurries, hu rau peb pab neeg kom paub seb peb cov kev tsim kho tshiab tuaj yeem txhim kho koj cov txheej txheem ntau lawm li cas.
- Cov Pob Zeb Diamond Tshwj Xeeb:
Cov Lus Tseem CeebKev Siv Tshuab Sib Tsoo Nyiv Pooj 2025, Boreas, pob zeb diamond micropowder, pob zeb diamond slurry, SiC wafer polishing, GaN substrate sib tsoo, CMP, semiconductor manufacturing, GTJ 2025