Hōʻikeʻike o ka ʻenehana wili 2025 Iapana
ʻenehana wili Iapana 2025
Henan Boreas New Material Co., Ltd.
ʻO kaʻenehana wili Iapana (GTJ) 2025, i mālama ʻia maiMalaki 5–7, 2025, ma kaHale Hālāwai Kūwaho ʻo Makuhari Messema Chiba Prefecture, ua hoʻopaʻa i kona kaulana ʻo ia ka hanana koʻikoʻi o ʻAsia no nā ʻenehana wili a me ka polishing holomua. Ke kālele nei i ka mīkini kikoʻī kiʻekiʻe, ka automation, a me nā hana hou, ua huki ka hōʻikeʻike i nā mea he nui300 mau mea hōʻikeʻikea me15,000 mau malihini loeamai nā ʻoihana semiconductor, automotive, a me nā mea holomua
Ua hōʻike ka hanana i nā holomua koʻikoʻi iSiC (silicon carbide)a meGaN (gallium nitride)ka hana ʻana i ka wafer, e kūlike ana me ke alakaʻi ʻana o Iapana i ka hana semiconductor. ʻO nā ʻano huahana koʻikoʻi e komo pū ana me nā mīkini wili, nā abrasives, nā mea hana daimana, nā wai polishing, a me nā ʻōnaehana ana pololei, me ka manaʻo nui i nā hoʻonā no nā hoʻopau ʻili ultra-smooth a me ka pono o ke kaʻina hana.
Ka Komo ʻana o Boreas: Hale Kūʻai G108
ʻO Boreas, kahi mea hana hou honua i nā hoʻonā abrasive holomua, i hōʻike i kāna mau huahana hae—nā pauka daimanaa menā slurries daimana hana kiʻekiʻe—maHale Kūʻai G108Ua hana ʻia kēia mau hoʻonā e hoʻoponopono i nā koi koʻikoʻi o ka hana ʻana o ka substrate SiC a me GaN, e hāʻawi ana i ka pololei a me ke kūlike ʻole no nā noi koʻikoʻi i nā electronics mana a me ka optoelectron.
Nā Hiʻohiʻona Huahana a me ka Hopena o ka Mākeke
- Nā pauka liʻiliʻi daimana:
Hoʻopilikino ʻia nā micropowders daimana like ʻole o Boreas noCMP (hoʻolālā mīkini kemika)a mewili pololei loao nā wafers SiC. ʻO kā lākou hoʻolaha ʻāpana submicron e hōʻoiaʻiʻo i nā hemahema ʻili liʻiliʻi a me nā helu hua kiʻekiʻe, kahi pono koʻikoʻi no nā mea hana e kuhikuhi ana i nā mākeke kaʻa uila (EV) hanauna hou a me 5G semiconductor.- Nā ʻōpala daimana kūikawā:
Ua hōʻike nā wai ʻaila kiʻekiʻe a aloha i ke kaiapuni o ka hui i nā hoʻomaikaʻi koʻikoʻi i ka hoʻopuehu ʻana i ka wela a me ke ola lōʻihi o ka mea hana i ka wā o nā kaʻina hana polishing GaN. Hoʻohālikelike kēia hana hou me nā ʻano o ka ʻoihana i nā laina hana hoʻomau a kiʻekiʻe.Ke Nānā Nei i Mua
ʻO ka holomua o Boreas ma GTJ 2025 e hōʻike ana i kāna kūpaʻa i ka hoʻolaha ʻana i nā ʻenehana hana semiconductor. I ka neʻe ʻana o ka ʻoihana i ka hoʻohana ʻana iā SiC a me GaN ākea, hoʻolālā ka ʻoihana e hoʻonui i kāna mau hoʻopukapuka R&D a hana pū me nā alakaʻi honua e hoʻomaʻemaʻe i nā hoʻonā wili hanauna hou.E hui pū me ka Precision Revolution
No ka ʻike hou aku e pili ana i nā micropowders daimana a Boreas a me nā slurries daimana, e kelepona i kā mākou hui e ʻimi pehea e hiki ai i kā mākou mau hana hou ke hoʻokiʻekiʻe i kāu mau kaʻina hana.
- Nā ʻōpala daimana kūikawā:
Nā huaʻōlelo koʻikoʻiʻEnehana Wili Iapana 2025, Boreas, diamond micropowder, diamond slurry, SiC wafer polishing, GaN substrate grinding, CMP, semiconductor manufacturing, GTJ 2025