Umboniso weTekhnoloji yokuGrila ka-2025 eJapan
Ubuchwepheshe bokuGrind eJapan 2025
IHenan Boreas New Material Co., Ltd.
IUbuchwepheshe bokuGrind eJapan (GTJ) 2025, ibanjwe kwiMatshi 5–7, 2025, eIndibano yeeNgqungquthela zaMazwe ngaMazwe yaseMakuhari MessekwiChiba Prefecture, yaqinisa udumo lwayo njengomsitho ophambili e-Asia wetekhnoloji yokugaya nokupolisha ephucukileyo. Igxile kwimishini echanekileyo, ukwenza izinto ngokuzenzekelayo, kunye notshintsho oluphambili, umboniso utsalwe ngabantu abaninzi.Ababonisi abangama-300kwayeIindwendwe eziyi-15,000 zobungcaliezivela kumashishini e-semiconductor, iimoto, kunye nezixhobo eziphambili
Esi siganeko sigxininise inkqubela phambili ebalulekileyo kwiI-SiC (i-silicon carbide)kwayeI-GaN (i-gallium nitride)ukucubungula i-wafer, okuhambelana nobunkokeli baseJapan kwimveliso ye-semiconductor. Iindidi eziphambili zeemveliso zaziquka oomatshini bokugaya, ii-abrasives, izixhobo zedayimani, ulwelo lokupolisha, kunye neenkqubo zokulinganisa ngokuchanekileyo, kugxininiswa kakhulu kwizisombululo zokugqitywa komphezulu okugudileyo kakhulu kunye nokusebenza kakuhle kwenkqubo.
Ukuthatha inxaxheba kukaBoreas: iBooth G108
IBoreas, inkampani entsha yehlabathi kwizisombululo eziphucukileyo ze-abrasive, ibonise iimveliso zayo eziphambili—iipowder zedayimani ezincincikwayeiidayimani ezisebenza kakuhle—kwiI-Booth G108Ezi zisombululo zenzelwe ukujongana neemfuno ezingqongqo zokucutshungulwa kwe-SiC kunye ne-GaN substrate, zibonelela ngokuchanekileyo nangokungaguquguqukiyo kwizicelo ezibalulekileyo kwi-electronics yamandla kunye ne-optoelectron.
Iimbalasane zeMveliso kunye neMpembelelo yeMarike
- Iidayimani ezincinci zomgubo:
Iipowder zedayimani ezilinganayo kakhulu zeBoreas zenzelweI-CMP (ucwangciso lwemichiza yekhemikhali)kwayeukugaya ngokuchanekileyo kakhuluii-wafers ze-SiC. Ukusasazwa kwazo kwee-submicron kuqinisekisa ukuba akukho ziphene zininzi kumphezulu kunye namazinga aphezulu emveliso, inzuzo ebalulekileyo kubavelisi abajolise kwiimarike zezithuthi zombane zesizukulwana esilandelayo (EV) kunye neemarike ze-semiconductor ze-5G.- Iidayimani zeSlurries ezikhethekileyo:
Ulwelo lwenkampani olunobuhlobo nokusingqongileyo, olunokuthambisa kakhulu, lubonakalise ukuphucuka okukhulu ekuchitheni ubushushu kunye nobude bexesha lezixhobo ngexesha leenkqubo zokupolisha zeGaN. Olu tshintsho luhambelana neendlela zoshishino eziya kwimigca yemveliso ezinzileyo nevelisa imveliso ephezulu.Ukujonga Phambili
Impumelelo yeBoreas kwiGTJ 2025 igxininisa ukuzinikela kwayo ekuphuculeni ubuchwepheshe bokuvelisa ii-semiconductor. Njengoko eli shishini litshintshela ekusetyenzisweni ngokubanzi kweSiC kunye neGaN, inkampani iceba ukwandisa utyalo-mali lwayo lwe-R&D kwaye isebenzisane neenkokheli zehlabathi ukuphucula izisombululo zokugaya zesizukulwana esilandelayo.Joyina iNguquko yoBuchule
Ukuze ufumane iinkcukacha ezithe vetshe ngee-micropowders zedayimani zaseBoreas kunye ne-slurry zedayimani, nxibelelana neqela lethu ukuze uhlole indlela izinto ezintsha esiziphuculayo ezinokuziphakamisa ngayo iinkqubo zakho zemveliso.
- Iidayimani zeSlurries ezikhethekileyo:
Amagama angundoqo: Ubuchwepheshe bokuGrindisha eJapan 2025, iiBoreas, i-diamond micropowder, i-diamond slurry, i-SiC wafer polishing, i-GaN substrate grinding, i-CMP, imveliso ye-semiconductor, i-GTJ 2025