Chiwonetsero cha Ukadaulo Wopera 2025 Japan
Ukadaulo Wopera Japan 2025
Malingaliro a kampani Henan Boreas New Material Co., Ltd.
TheUkadaulo Wopukutira Japan (GTJ) 2025, wogwidwa kuchokera kuMarichi 5–7, 2025, paMalo Ochitira Misonkhano Yapadziko Lonse a Makuhari Messeku Chiba Prefecture, idalimbitsa mbiri yake ngati chochitika chachikulu ku Asia cha ukadaulo wapamwamba wopera ndi kupukuta. Poyang'ana kwambiri pa makina olondola kwambiri, makina odzipangira okha, komanso zatsopano zamakono, chiwonetserochi chidakopa chidwi chaOwonetsa 300ndiAlendo 15,000 akatswirikuchokera ku mafakitale a semiconductor, magalimoto, ndi zipangizo zamakono
Chochitikachi chinawonetsa kupita patsogolo kwakukulu muSiC (silicon carbide)ndiGaN (gallium nitride)kukonza ma wafer, mogwirizana ndi utsogoleri wa Japan pakupanga ma semiconductor. Magulu akuluakulu azinthu anali makina opukutira, zopukutira, zida za diamondi, madzi opukutira, ndi njira zoyezera molondola, ndi cholinga chachikulu pa mayankho a kumaliza bwino kwambiri komanso kugwiritsa ntchito bwino ntchito.
Kutenga nawo mbali kwa Boreas: Booth G108
Boreas, kampani yatsopano padziko lonse lapansi yokonza njira zamakono zochepetsera ululu, yawonetsa zinthu zake zazikulu—ufa wa diamondindimiyala ya diamondi yogwira ntchito bwino kwambiri—paBooth G108Mayankho awa adapangidwa kuti akwaniritse zofunikira zolimba za SiC ndi GaN substrate processing, zomwe zimapereka kulondola kosayerekezeka komanso kusasinthasintha kwa ntchito zofunika kwambiri zamagetsi zamagetsi ndi optoelectron.
Zofunika Kwambiri pa Zamalonda ndi Zotsatira za Msika
- Ufa wa Diamondi Micro:
Ufa wa diamondi wa Boreas wofanana kwambiri ndi womwe umapangidwiraCMP (kupanga makina a mankhwala)ndikupukusira kolondola kwambiriza ma wafer a SiC. Kugawa kwa tinthu ta submicron kumatsimikizira kuti pali zolakwika zochepa pamwamba komanso kuchuluka kwa zokolola, zomwe ndi mwayi wofunikira kwa opanga omwe akufunafuna msika wamagetsi wamagetsi wa m'badwo wotsatira (EV) ndi misika ya semiconductor ya 5G.- Ma Dayamondi Opangidwa Mwapadera:
Madzi a kampaniyo omwe ndi abwino ku chilengedwe komanso opatsa mafuta ambiri awonetsa kusintha kwakukulu pakutaya kutentha komanso kukhala ndi moyo wautali wa zida panthawi ya ntchito za GaN polishing. Lusoli likugwirizana ndi zomwe zikuchitika m'makampani opanga zinthu zokhazikika komanso zogwira ntchito kwambiri.Kuyang'ana Patsogolo
Kupambana kwa Boreas pa GTJ 2025 kukugogomezera kudzipereka kwake pakupititsa patsogolo ukadaulo wopanga zinthu za semiconductor. Pamene makampaniwa akusintha kupita ku kukhazikitsidwa kwa SiC ndi GaN, kampaniyo ikukonzekera kukulitsa ndalama zake za R&D ndikugwirira ntchito limodzi ndi atsogoleri apadziko lonse lapansi kuti akonze njira zatsopano zopangira zinthu.Lowani nawo mu Precision Revolution
Kuti mudziwe zambiri zokhudza ufa wa diamondi wa Boreas ndi matope a diamondi, funsani gulu lathu kuti mudziwe momwe zatsopano zathu zingakwezere ntchito zanu zopangira.
- Ma Dayamondi Opangidwa Mwapadera:
Mawu Ofunika: Ukadaulo Wopukutira Japan 2025, Boreas, ufa wa diamondi wochepa, slurry ya diamondi, kupukuta kwa SiC wafer, kupukuta kwa GaN substrate, CMP, kupanga ma semiconductor, GTJ 2025