Ukukhetha i-Diamond Micro Powder ye-Wire Saws

Amasaha ensimbi edayimane afakwe ngogesi asetshenziswa kabanzi ekusikeni izinto ezibiza kakhulu njenge-solar silicon wafers, ama-LED, ama-semiconductors, amatshe ayigugu, izinto ezisebenza ngomagnetic, kanye nengilazi ebonakalayo. Lawa masaha anikeza izinzuzo ezibalulekile, okuhlanganisa ukusebenza kahle kokusika, ukunemba, kanye nobungane bemvelo. Ngokuthuthuka kobuchwepheshe besaha lensimbi edayimane, ikakhulukazi embonini yokusika i-silicon ye-photovoltaic, amasaha ensimbi edayimane athathe indawo ngokuphelele yezindlela zokusika zendabuko ze-silicon carbide slurry, athuthukisa kakhulu isivinini sokusika kanye nekhwalithi, futhi aqhubekisela phambili ukukhula okusheshayo embonini yelanga.

Amasaha ensimbi edayimane afakwe ngogesi enziwa ngokubopha ama-abrasives edayimane ocingweni oluyinhloko kusetshenziswa insimbi efakwe ngogesi njenge-binder. Ukuqina kanye nekhwalithi yalawa masaha ensimbi kuthonywa yizici eziningana, okuhlanganisa i-diamond micro powder (engagugiyo), i-bare wire, kanye nenqubo ye-electroplating. Phakathi kwalokhu, i-diamond micro powder iyisici esibalulekile esithinta ukusebenza kanye nokuqina kwekhwalithi yesaha lensimbi.

Incazelo kanye nezici ze-Diamond Micro Powder

Impuphu yedayimane encane iqukethe izinhlayiya ezincane zedayimane ezisukela kuma-micrometer ayi-1 kuya kwayi-100, ngokuvamile ezikhiqizwa ngokuchoboza izinhlamvu zedayimane eziqinile zekristalu elilodwa, ezibizwa ngokuthi impuphu yedayimane echotshoziwe. Le nqubo yokukhiqiza ilula, ikhiqiza kakhulu, futhi isetshenziswa kabanzi ekukhiqizeni amasosi edayimane.

Izici ezidingekayo ukuze kukhiqizwe i-diamond micro powder ekukhiqizweni kwe-wire saw zifaka phakathi izici ezintathu: usayizi wezinhlayiya, ukuma, kanye namandla:

• Usayizi Wezinhlayiya: Lokhu kufaka phakathi ukusatshalaliswa kosayizi wezinhlayiya, ububanzi bezinhlayiya obumaphakathi, kanye neminye imingcele efanele. Ubukhulu bezinhlayiya obuchazwe ngokucacile bubalulekile ukuze kusetshenziswe ngempumelelo.
• Isimo Sezinhlayiyana: Amapharamitha womumo, njengokuyindilinga kanye nokugoba, athinta ngqo inqubo yokufakelwa kwe-electroplating kanye nokusebenza kwayo yonke. Uma ukuma kwezinhlayiya ze-micro powder kungahambisani nenqubo yokufakelwa kwe-electroplating noma izimo zokusebenza, ukuthola imiphumela emihle kuba nzima.
• Amandla Ezinhlayiya: Amandla empuphu encane echotshoziwe ahlobene eduze namandla endwangu yedayimane eyodwa yekristalu yokuqala. Amandla aphezulu okuqala aphumela kumpuphu encane enamandla. Impuphu encane enamandla aphansi iholela ekusebenzeni kabi kokusika nokuqina, okuholela emikhiqizweni engazinzile.

Ukukhetha i-Diamond Micro Powder

Usayizi Wezinhlayiya Zempuphu Encane: Uma ukhetha i-diamond micro powder yama-wire saw, gxila kusayizi wezinhlayiya ezimaphakathi, ukwakheka kosayizi, kanye nezici zokusatshalaliswa. Usayizi wezinhlayiya ezimaphakathi uyinkomba eyinhloko, evame ukumelwa yinani le-d50.

Udaba Lwezinhlayiya Ezinkulu: Izinhlayiya ezinkulu ngaphakathi kwempuphu encane "ziyiphutha elibulalayo." Kungakhathaliseki ukuthi ezinye izici zilingana kahle kangakanani, ukuba khona kwezinhlayiya ezinkulu kwenza impuphu encane ingasetshenziswa. Ekusetshenzisweni kwesaha lensimbi, izinhlayiya ezinkulu zingabangela imihuzuko emsebenzini ngesikhathi sokusika.

Isimo Sezinhlayiyana: Impuphu yedayimane encane ihlanganisa izinhlayiya ezihlukahlukene ezibunjiwe. Ukuma kuthinta ngqo ukumbozwa ezindaweni zedayimane, inqubo yokufakelwa kwe-electroplating yesaha lensimbi, kanye nokusebenza kwayo. Inqubo yokukhiqiza inquma ukuma kwezinhlayiya, futhi ukukhetha kusengaphambili kuvame ukufaka ukwakheka ukuze kususwe izinhlayiya ezingajwayelekile, okwenza kube lula ukuhlunga nokusetshenziswa okungcono. Ukuzungeza kuyipharamitha evame ukusetshenziswa ukuchaza ukuma kwezinhlayiya.

Amandla: Amandla e-diamond micro powder athinta kakhulu ukusebenza nokuqina kwama-wire saw. Amandla aphezulu ahlobene nekhono lokusika elingcono kanye nokuqina kwekhwalithi. Amandla e-micro powder ancike kakhulu emandleni ezinto zokusetshenziswa, ezivame ukuhlolwa kusetshenziswa ukuqina komthelela (T) noma ukuqina komthelela wokushisa (TTI).