Ukukhetha iDiamond Micro Powder kwiWire Saws

Iisarha zentsimbi yedayimani ezifakwe ngombane zisetyenziswa kakhulu ekusikeni izinto ezixabisa kakhulu ezifana nee-solar silicon wafers, ii-LED, ii-semiconductors, amatye anqabileyo, izinto zemagnethi, kunye neglasi ebonakalayo. Ezi sarha zibonelela ngeenzuzo ezibalulekileyo, kubandakanya ukusebenza kakuhle kokusika, ukuchaneka, kunye nobuhlobo nokusingqongileyo. Ngokuhambela phambili kwetekhnoloji yesarha yentsimbi yedayimani, ngakumbi kwishishini lokusika i-photovoltaic silicon, iisarha zentsimbi yedayimani ziye zathatha indawo yeendlela zokusika ze-silicon carbide slurry zemveli, zandisa kakhulu isantya sokusika kunye nomgangatho, kwaye ziqhuba ukukhula ngokukhawuleza kwishishini lelanga.

Iisarha zentambo zedayimani ezifakwe ngombane zenziwa ngokubopha ii-abrasives zedayimani kwintambo engundoqo kusetyenziswa isinyithi esifakwe ngombane njengesihlanganisi. Uzinzo kunye nomgangatho wezi sarha zentambo ziphenjelelwa zizinto ezahlukeneyo, kubandakanya i-diamond micro powder (i-abrasive), i-bare wire, kunye nenkqubo ye-electroplating. Phakathi kwezi, i-diamond micro powder yinto ebalulekileyo echaphazela ukusebenza kunye nozinzo lomgangatho wesarha yentambo.

Inkcazo kunye neempawu zeDiamond Micro Powder

I-Diamond micro powder inamasuntswana amancinci edayimani aqala kwi-1 ukuya kwi-100 micrometers, adla ngokuveliswa ngokutyumza iinkozo zedayimani ezirhabaxa zekristale enye, ezibizwa ngokuba yi-crushed micro powder. Le nkqubo yokuvelisa ilula, inemveliso ephezulu, kwaye isetyenziswa kakhulu ekuveliseni iisarha zentambo yedayimani.

Iimpawu ezifunekayo kwi-diamond micro powder kwimveliso yesarha yentsimbi ziquka ikakhulu iinkalo ezintathu: ubungakanani bamasuntswana, imilo, kunye namandla:

• Ubungakanani beParticle: Oku kuquka ukusasazwa kobungakanani besuntswana, ububanzi obuphakathi besuntswana, kunye nezinye iiparameter ezifanelekileyo. Ubungakanani besuntswana obuchazwe ngokucacileyo bubalulekile ukuze kusetyenziswe ngempumelelo.
• Imilo yamasuntswana: Iiparameter zemilo, ezinje ngokujikeleza kunye nokugoba, zichaphazela ngokuthe ngqo inkqubo ye-electroplating kunye nokusebenza kwayo iyonke. Ukuba imilo yesuntswana ye-micro powder ayihambelani nenkqubo ye-electroplating okanye iimeko zokusebenza, ukufumana iziphumo ezilungileyo kuba nzima.
• Amandla eenxalenye: Amandla e-micro powder etyumkileyo anxulumene ngokusondeleyo namandla e-single crystal diamond material yokuqala. Amandla aphezulu okuqala abangela i-micro powder enamandla. I-micro powder enamandla aphantsi ikhokelela ekusebenzeni kakubi kokusikwa kunye nokuqina, okubangela iimveliso ezingazinzanga.

Ukukhetha iDiamond Micro Powder

Ubungakanani beParticle yePowder encinci: Xa ukhetha i-diamond micro powder kwiisarha zentambo, gxila kubungakanani obuqhelekileyo be-particle, ubungakanani bokwakheka, kunye neempawu zokusasazwa. Ubungakanani obuqhelekileyo be-particle sisalathisi esiphambili, esidla ngokumelwa lixabiso le-d50.

Ingxaki Yeenxalenye Ezinkulu: Amasuntswana amakhulu ngaphakathi kwi-micro powder "ayinasiphako esibulalayo." Nokuba ezinye iimpawu zilingana kakuhle kangakanani na, ukubakho kwamasuntswana amakhulu kwenza i-micro powder ingasebenzi. Kwizicelo zesarha yentsimbi, amasuntswana amakhulu anokubangela imikrwelo kwindawo yokusebenza ngexesha lokusika.

Imilo yamasuntswana: Umgubo wedayimani omncinci uqulathe amasuntswana ahlukeneyo aneemilo ezahlukeneyo. Ubume buchaphazela ngokuthe ngqo ukugquma kwiindawo zedayimani, inkqubo yokufakelwa kwe-electroplating yesarha yentambo, kunye nokusebenza kwayo. Inkqubo yemveliso imisela ubume bamasuntswana, kwaye ukukhetha kwangaphambili kudla ngokuquka ukubumba ukususa amasuntswana angaqhelekanga, okwenza kube lula ukuhlela nokufaka ngcono. Ubungqindilili yiparameter esetyenziswa rhoqo ukuchaza ubume bamasuntswana.

Amandla: Amandla e-diamond micro powder achaphazela kakhulu ukusebenza kunye nokuqina kweesarha zentsimbi. Amandla aphezulu ahambelana nokukwazi ukusika okungcono kunye nozinzo kumgangatho. Amandla e-micro powder axhomekeke kakhulu kumandla ezinto eziluhlaza, ezihlala zivavanywa kusetyenziswa ubulukhuni bempembelelo (T) okanye ubulukhuni bempembelelo yobushushu (TTI).